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  • PCB詞匯中英文對照
    發布時間:2010-4-21

    一、綜合詞匯

    1、印製電路:printed circuit
    2、印製線路:printed wiring
    3、印製板:printed board
    4、印製板電路:printed circuit board (PCB)
    5、印製線路板:printed wiring board(PWB)
    6、印製元件:printed component
    7、印製接點:printed contact
    8、印製板裝配:printed board assembly
    9、板:board
    10、單麵印製板:single-sided printed board(SSB)
    11、雙麵印製板:double-sided printed board(DSB)
    12、多層印製板:mulitlayer printed board(MLB)
    13、多層印製電路板:mulitlayer printed circuit board
    14、多層印製線路板:mulitlayer prited wiring board
    15、剛性印製板:rigid printed board
    16、剛性單麵印製板:rigid single-sided printed borad
    17、剛性雙麵印製板:rigid double-sided printed borad
    18、剛性多層印製板:rigid multilayer printed board
    19、撓性多層印製板:flexible multilayer printed board
    20、撓性印製板:flexible printed board
    21、撓性單麵印製板:flexible single-sided printed board
    22、撓性雙麵印製板:flexible double-sided printed board
    23、撓性印製電路:flexible printed circuit (FPC)
    24、撓性印製線路:flexible printed wiring
    25、剛性印製板:flex-rigid printed board, rigid-flex printed board
    26、剛性雙麵印製板:flex-rigid double-sided printed board, rigid-flex double-sided printed
    27、剛性多層印製板:flex-rigid multilayer printed board, rigid-flex multilayer printed board
    28、齊平印製板:flush printed board
    29、金屬芯印製板:metal core printed board
    30、金屬基印製板:metal base printed board
    31、多重布線印製板:mulit-wiring printed board
    32、陶瓷印製板:ceramic substrate printed board
    33、導電膠印製板:electroconductive paste printed board
    34、模塑電路板:molded circuit board
    35、模壓印製板:stamped printed wiring board
    36、順序層壓多層印製板:sequentially-laminated mulitlayer
    37、散線印製板:discrete wiring board
    38、微線印製板:micro wire board
    39、積層印製板:buile-up printed board
    40、積層多層印製板:build-up mulitlayer printed board (BUM)
    41、積層撓印製板:build-up flexible printed board
    42、表麵層合電路板:surface laminar circuit (SLC)
    43、埋入凸塊連印製板:B2it printed board
    44、多層膜基板:multi-layered film substrate(MFS)
    45、層間全內導通多層印製板:ALIVH multilayer printed board
    46、載芯片板:chip on board (COB)
    47、埋電阻板:buried resistance board
    48、母板:mother board
    49、子板:daughter board
    50、背板:backplane
    51、裸板:bare board
    52、鍵盤板夾心板:copper-invar-copper board
    53、動態撓性板:dynamic flex board
    54、靜態撓性板:static flex board
    55、可斷拚板:break-away planel
    56、電纜:cable
    57、撓性扁平電纜:flexible flat cable (FFC)
    58、薄膜開關:membrane switch
    59、混合電路:hybrid circuit
    60、厚膜:thick film
    61、厚膜電路:thick film circuit
    62、薄膜:thin film
    63、薄膜混合電路:thin film hybrid circuit
    64、互連:interconnection
    65、導線:conductor trace line
    66、齊平導線:flush conductor
    67、傳輸線:transmission line
    68、跨交:crossover
    69、板邊插頭:edge-board contact
    70、增強板:stiffener
    71、基底:substrate
    72、基板麵:real estate
    73、導線麵:conductor side
    74、元件麵:component side
    75、焊接麵:solder side
    76、印製:printing
    77、網格:grid
    78、圖形:pattern
    79、導電圖形:conductive pattern
    80、非導電圖形:non-conductive pattern
    81、字符:legend
    82、標誌:mark


    二、基材:

    1、基材:base material
    2、層壓板:laminate
    3、覆金屬箔基材:metal-clad bade material
    4、覆銅箔層壓板:copper-clad laminate (CCL)
    5、單麵覆銅箔層壓板:single-sided copper-clad laminate
    6、雙麵覆銅箔層壓板:double-sided copper-clad laminate
    7、複合層壓板:composite laminate
    8、薄層壓板:thin laminate
    9、金屬芯覆銅箔層壓板:metal core copper-clad laminate
    10、金屬基覆銅層壓板:metal base copper-clad laminate
    11、撓性覆銅箔絕緣薄膜:flexible copper-clad dielectric film
    12、基體材料:basis material
    13、預浸材料:prepreg
    14、粘結片:bonding sheet
    15、預浸粘結片:preimpregnated bonding sheer
    16、環氧玻璃基板:epoxy glass substrate
    17、加成法用層壓板:laminate for additive process
    18、預製內層覆箔板:mass lamination panel
    19、內層芯板:core material
    20、催化板材:catalyzed board ,coated catalyzed laminate
    21、塗膠催化層壓板:adhesive-coated catalyzed laminate
    22、塗膠無催層壓板:adhesive-coated uncatalyzed laminate
    23、粘結層:bonding layer
    24、粘結膜:film adhesive
    25、塗膠粘劑絕緣薄膜:adhesive coated dielectric film
    26、無支撐膠粘劑膜:unsupported adhesive film
    27、覆蓋層:cover layer (cover lay)
    28、增強板材:stiffener material
    29、銅箔麵:copper-clad surface
    30、去銅箔麵:foil removal surface
    31、層壓板麵:unclad laminate surface
    32、基膜麵:base film surface
    33、膠粘劑麵:adhesive faec
    34、原始光潔麵:plate finish
    35、粗麵:matt finish
    36、縱向:length wise direction
    37、模向:cross wise direction
    38、剪切板:cut to size panel
    39、酚醛紙質覆銅箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
    40、環氧紙質覆銅箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
    41、環氧玻璃布基覆銅箔板:epoxide woven glass fabric copper-clad laminates
    42、環氧玻璃布紙複合覆銅箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
    43、環氧玻璃布玻璃纖維複合覆銅箔板:epoxide non woven/woven glass reinforced copper-clad laminates
    44、聚酯玻璃布覆銅箔板:ployester woven glass fabric copper-clad laminates
    45、聚酰亞胺玻璃布覆銅箔板:polyimide woven glass fabric copper-clad laminates
    46、雙馬來酰亞胺三嗪環氧玻璃布覆銅箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
    47、環氧合成纖維布覆銅箔板:epoxide synthetic fiber fabric copper-clad laminates
    48、聚四乙烯玻璃纖維覆銅箔板:teflon/fiber glass copper-clad laminates
    49、超薄型層壓板:ultra thin laminate
    50、陶瓷基覆銅箔板:ceramics base copper-clad laminates
    51、紫外線阻擋型覆銅箔板:UV blocking copper-clad laminates

    三、基材的材料

    1、 A階樹脂:A-stage resin
    2、 B階樹脂:B-stage resin
    3、 C階樹脂:C-stage resin
    4、環氧樹脂:epoxy resin
    5、酚醛樹脂:phenolic resin
    6、聚酯樹脂:polyester resin
    7、聚酰亞胺樹脂:polyimide resin
    8、雙馬來酰亞胺三嗪樹脂:bismaleimide-triazine resin
    9、丙烯酸樹脂:acrylic resin
    10、三聚氰胺甲醛樹脂:melamine formaldehyde resin
    11、多官能環氧樹脂:polyfunctional epoxy resin
    12、溴化環氧樹脂:brominated epoxy resin
    13、環氧酚醛:epoxy novolac
    14、氟樹脂:fluroresin
    15、矽樹脂:silicone resin
    16、矽烷:silane
    17、聚合物:polymer
    18、無定形聚合物:amorphous polymer
    19、結晶現象:crystalline polamer
    20、雙晶現象:dimorphism
    21、共聚物:copolymer
    22、合成樹脂:synthetic
    23、熱固性樹脂:thermosetting resin
    24、熱塑性樹脂:thermoplastic resin
    25、感光性樹脂:photosensitive resin
    26、環氧當量:weight per epoxy equivalent (WPE)
    27、環氧值:epoxy value
    28、雙氰胺:dicyandiamide
    29、粘結劑:binder
    30、膠粘劑:adesive
    31、固化劑:curing agent
    32、阻燃劑:flame retardant
    33、遮光劑:opaquer
    34、增塑劑:plasticizers
    35、不飽和聚酯:unsatuiated polyester
    36、聚酯薄膜:polyester
    37、聚酰亞胺薄膜:polyimide film (PI)
    38、聚四氟乙烯:polytetrafluoetylene (PTFE)
    39、聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film (FEP)
    40、增強材料:reinforcing material
    41、玻璃纖維:glass fiber
    42、 E玻璃纖維:E-glass fibre
    43、 D玻璃纖維:D-glass fibre
    44、 S玻璃纖維:S-glass fibre
    45、玻璃布:glass fabric
    46、非織布:non-woven fabric
    47、玻璃纖維墊:glass mats
    48、紗線:yarn
    49、單絲:filament
    50、絞股:strand
    51、緯紗:weft yarn
    52、經紗:warp yarn
    53、但尼爾:denier
    54、經向:warp-wise
    55、緯向:weft-wise, filling-wise
    56、織物經緯密度:thread count
    57、織物組織:weave structure
    58、平紋組織:plain structure
    59、壞布:grey fabric
    60、稀鬆織物:woven scrim
    61、弓緯:bow of weave
    62、斷經:end missing
    63、缺緯:mis-picks
    64、緯斜:bias
    65、折痕:crease
    66、雲織:waviness
    67、魚眼:fish eye
    68、毛圈長:feather length
    69、厚薄段:mark
    70、裂縫:split
    71、撚度:twist of yarn
    72、浸潤劑含量:size content
    73、浸潤劑殘留量:size residue
    74、處理劑含量:finish level
    75、浸潤劑:size
    76、偶聯劑:couplint agent
    77、處理織物:finished fabric
    78、聚酰胺纖維:polyarmide fiber
    79、聚酯纖維非織布:non-woven polyester fabric
    80、浸漬絕緣縱紙:impregnating insulation paper
    81、聚芳酰胺纖維紙:aromatic polyamide paper
    82、斷裂長:breaking length
    83、吸水高度:height of capillary rise
    84、濕強度保留率:wet strength retention
    85、白度:whitenness
    86、陶瓷:ceramics
    87、導電箔:conductive foil
    88、銅箔:copper foil
    89、電解銅箔:electrodeposited copper foil (ED copper foil)
    90、壓延銅箔:rolled copper foil
    91、退火銅箔:annealed copper foil
    92、壓延退火銅箔:rolled annealed copper foil (RA copper foil)
    93、薄銅箔:thin copper foil
    94、塗膠銅箔:adhesive coated foil
    95、塗膠脂銅箔:resin coated copper foil (RCC)
    96、複合金屬箔:composite metallic material
    97、載體箔:carrier foil
    98、殷瓦:invar
    99、箔(剖麵)輪廓:foil profile
    100、光麵:shiny side
    101、粗糙麵:matte side
    102、處理麵:treated side
    103、防鏽處理:stain proofing
    104、雙麵處理銅箔:double treated foil

    四、設計

    1、原理圖:shematic diagram
    2、邏輯圖:logic diagram
    3、印製線路布設:printed wire layout
    4、布設總圖:master drawing
    5、可製造性設計:design-for-manufacturability
    6、計算機輔助設計:computer-aided design.(CAD)
    7、計算機輔助製造:computer-aided manufacturing.(CAM)
    8、計算機集成製造:computer integrat manufacturing.(CIM)
    9、計算機輔助工程:computer-aided engineering.(CAE)
    10、計算機輔助測試:computer-aided test.(CAT)
    11、電子設計自動化:electric design automation .(EDA)
    12、工程設計自動化:engineering design automaton .(EDA2)
    13、組裝設計自動化:assembly aided architectural design. (AAAD)
    14、計算機輔助製圖:computer aided drawing
    15、計算機控製顯示:computer controlled display .(CCD)
    16、布局:placement
    17、布線:routing
    18、布圖設計:layout
    19、重布:rerouting
    20、模擬:simulation
    21、邏輯模擬:logic simulation
    22、電路模擬:circit simulation
    23、時序模擬:timing simulation
    24、模塊化:modularization
    25、布線完成率:layout effeciency
    26、機器描述格式:machine descriptionm format .(MDF)
    27、機器描述格式數據庫:MDF databse
    28、設計數據庫:design database
    29、設計原點:design origin
    30、優化(設計):optimization (design)
    31、供設計優化坐標軸:predominant axis
    32、表格原點:table origin
    33、鏡像:mirroring
    34、驅動文件:drive file
    35、中間文件:intermediate file
    36、製造文件:manufacturing documentation
    37、隊列支撐數據庫:queue support database
    38、元件安置:component positioning
    39、圖形顯示:graphics dispaly
    40、比例因子:scaling factor
    41、掃描填充:scan filling
    42、矩形填充:rectangle filling
    43、填充域:region filling
    44、實體設計:physical design
    45、邏輯設計:logic design
    46、邏輯電路:logic circuit
    47、層次設計:hierarchical design
    48、自頂向下設計:top-down design
    49、自底向上設計:bottom-up design
    50、線網:net
    51、數字化:digitzing
    52、設計規則檢查:design rule checking
    53、走(布)線器:router (CAD)
    54、網絡表:net List
    55、計算機輔助電路分析:computer-aided circuit analysis
    56、子線網:subnet
    57、目標函數:objective function
    58、設計後處理:post design processing (PDP)
    59、交互式製圖設計:interactive drawing design
    60、費用矩陣:cost metrix
    61、工程圖:engineering drawing
    62、方塊框圖:block diagram
    63、迷宮:moze
    64、元件密度:component density
    65、巡回售貨員問題:traveling salesman problem
    66、自由度:degrees freedom
    67、入度:out going degree
    68、出度:incoming degree
    69、曼哈頓距離:manhatton distance
    70、歐幾裏德距離:euclidean distance
    71、網絡:network
    72、陣列:array
    73、段:segment
    74、邏輯:logic
    75、邏輯設計自動化:logic design automation
    76、分線:separated time
    77、分層:separated layer
    78、定順序:definite sequence

    五、形狀與尺寸:

    1、導線(通道):conduction (track)
    2、導線(體)寬度:conductor width
    3、導線距離:conductor spacing
    4、導線層:conductor layer
    5、導線寬度/間距:conductor line/space
    6、第一導線層:conductor layer No.1
    7、圓形盤:round pad
    8、方形盤:square pad
    9、菱形盤:diamond pad
    10、長方形焊盤:oblong pad
    11、子彈形盤:bullet pad
    12、淚滴盤:teardrop pad
    13、雪人盤:snowman pad
    14、 V形盤:V-shaped pad
    15、環形盤:annular pad
    16、非圓形盤:non-circular pad
    17、隔離盤:isolation pad
    18、非功能連接盤:monfunctional pad
    19、偏置連接盤:offset land
    20、腹(背)裸盤:back-bard land
    21、盤址:anchoring spaur
    22、連接盤圖形:land pattern
    23、連接盤網格陣列:land grid array
    24、孔環:annular ring
    25、元件孔:component hole
    26、安裝孔:mounting hole
    27、支撐孔:supported hole
    28、非支撐孔:unsupported hole
    29、導通孔:via
    30、鍍通孔:plated through hole (PTH)
    31、餘隙孔:access hole
    32、盲孔:blind via (hole)
    33、埋孔:buried via hole
    34、埋/盲孔:buried /blind via
    35、任意層內部導通孔:any layer inner via hole (ALIVH)
    36、全部鑽孔:all drilled hole
    37、定位孔:toaling hole
    38、無連接盤孔:landless hole
    39、中間孔:interstitial hole
    40、無連接盤導通孔:landless via hole
    41、引導孔:pilot hole
    42、端接全隙孔:terminal clearomee hole
    43、準表麵間鍍覆孔:quasi-interfacing plated-through hole
    44、準尺寸孔:dimensioned hole
    45、在連接盤中導通孔:via-in-pad
    46、孔位:hole locations
    47、孔密度:hole density
    48、孔圖:hole pattern
    49、鑽孔圖:drill drawing
    50、裝配圖:assembly drawing
    51、印製板組裝圖:printed board assembly drawing
    52、參考基準:datum referance
    54、基準尺寸:reference dimension
    55、參考尺寸:reaerence dimension
    56、直接量定尺寸:direct dimensioning
    57、基準圖:datum feature
    58、基準邊:reference edge
    59、導線設計距離:design space of conductor
    60、導線設計寬度:design width of conductor
    61、中心距:center to center spacing
    62、線寬/間距:conductor width/space
    63、節距:pitch
    64、精細節距:fine pitch
    65、層:layer
    66、層間距:layer-to-layer spacing
    67、邊距:edge spacing
    68、外形線:trim line
    69、截麵積:crossection area
    70、真實值表測量:truth table test
    71、準確位置:true position tolerance
    72、精確位置:accuracy
    73、精確位置誤差:cumulative tolerance
    74、精確度:accuracy
    75、累積誤差:cumulative tolerance
    76、焊墊:footprint
    77、外層:external layer
    78、內層:internal layer
    79、接地層:ground plane
    80、接地層隔離:ground plane clearance
    81、電壓層:voltage plane
    82、電源層隔離:voltage plane clearance
    83、電源層:power plane, bus plane
    84、導通網絡:basic grid
    85、導通網格:track grid
    86、導通孔網格:via grid
    87、連通盤網格:pad (land) grid
    88、定位偏差:positional tolerance
    89、對準靶標:bornb sight
    90、梳狀圖形:comb pattern
    91、對準標記:register mark
    92、散熱層:heat sink plane

    六、電氣互連

    1、表麵間連接:interlayer connection
    2、層間連接:interlayer connection
    3、內層連接:innerlayer connection
    4、非功能表麵連接:nonfunctional interfacial connection
    5、跨接線:jumper wire
    6、節(交)點:node
    7、附加線:haywire
    8、端接(點):terminal
    9、連接線:terminated line
    10、端接:termination
    11、連接端:pad, land
    12、貫穿連接:through connection
    13、支線:stub
    14、印製插頭:tab
    15、鍵槽:keying slot
    16、連接器:connector
    17、板邊連接器:edge board connector
    18、連接器區:connector area
    19、直角板邊連接器:right angle edge connector
    20、偏槽口:polarizing slot
    21、偏置端接區:offset terminal area
    22、接地:ground
    23、端接隔離(空環):terminal clearance
    24、連通性:continuity
    25、連接器接觸:connector contact
    26、接觸麵積:contact area
    27、接觸間距:contact spacing
    28、接觸電阻:contact resistance
    29、接觸尺寸:contact size
    30、元件引腿(腳):component lead
    31、元件插針:component pin
    32、最小電氣間距:minimum electrical spacing
    33、導電性:conductivity
    34、邊卡連接器:card-edge connector
    35、插卡連接器:card-insertion connector
    36、載流量:current-carrying capacity
    37、蹯徑:path
    38、最短路徑:shortest path
    39、關鍵路徑:critical path
    40、倒角:miter
    41、串推:daisy chain
    42、斯坦納樹:steiner tree
    43、最小生成樹:minimum spanning tree (MST)
    44、瓶頸寬度:necked width
    45、短叉長度:spur length
    46、短柱長度:stub length
    47、曼哈頓路徑:manhattan path
    48、連接度(性):connectivity

    七、其它

    1、主麵:primary side
    2、輔麵:secondary side
    3、支撐麵:supporting plane
    4、信號:signal
    5、信號導線:signal conductor
    6、信號地線:signal ground
    7、信號速率:signal rate
    8、信號標準化:signal standardization
    9、信號層:signal layer
    10、寄生信號:spurious signal
    11、串擾:crosstalk
    12、電容:capacitance
    13、電容耦合:capacitive coupling
    14、電磁幹擾:electromagnetic interference
    15、電磁屏蔽:electromangetic shielding
    16、噪音:noise
    17、電磁兼容性:electromagnetic compatbility
    18、特性阻抗:impedance
    19、阻抗匹配:impedance match
    20、電感:inductance
    21、延遲:delay
    22、微帶線:microstrip
    23、帶狀線:stripline
    24、探測點:probe point
    25、開窗口:cross hatching
    26、跨距:span
    27、共麵性(度):coplanarity
    28、埋入電阻:buried resistance
    29、黃金板:golden board
    30、芯板:core board
    31、薄基芯:thin core
    32、非均衡傳輸線:unbalanced transmission line
    33、閥值:threshold
    34、極限值:threshold limit value(TLV)
    35、散熱層:heat sink plane
    36、熱隔離:heat sink plane
    37、導通孔堵塞:via filiing
    38、波動:surge
    39、卡板:card
    40、卡板盒/卡板櫃:card cages/card racks
    41、薄型多層板:thin type multilayer board
    42、埋/盲孔多層板:
    43、模塊:module
    44、單芯片模塊:single chip module (SCM)
    45、多芯片模塊:multichip module (MCM)
    46、多芯片模塊層壓基板:laminate substrate version of multichip module (MCM-L)
    47、多芯片模塊陶瓷基數板:ceramic substrate version o fmultichip module (MCM-C)
    48、多芯片模塊薄膜基板:deposition thin film substrate version of multilayer module (MCM-D)
    49、嵌入凸塊互連技術:buried bump interconnection technology (B2 it)
    50、自動測試技術:automatic test equipment (ATE)
    51、芯板導通孔堵塞:core board viafilling
    52、對準標記:alignment mark
    53、基準標記:fiducial mark
    54、拐角標記:corner mark
    55、剪切標記:crop mark
    56、銑切標記:routing mark
    57、對位標記:registration mark
    58、縮減標記:reduvtion mark
    59、層間重合度:layer to layer registration
    60、狗骨結構:dog hone
    61、熱設計:thermal design
    62、熱阻:thermal resistance

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