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製程能力
線路板客服
PCB文章精華
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硬板製程能力
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英製 |
公製 |
1 |
最大拚版尺寸 |
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22" x 26" |
550 x 650mm |
2 |
孔徑 |
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最小成品孔徑 |
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0.004" |
0.10mm |
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成品孔公差 |
沉銅孔 |
±0.003" |
±0.075mm |
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非沉銅孔 |
±0.002" |
±0.050mm |
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壓合 |
±0.002" |
±0.050mm |
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縱橫比 |
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9 : 1 |
9 : 1 |
3 |
激光孔 |
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微孔直徑 |
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0.004" - 0.010" |
0.10 - 0.15mm |
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縱橫比 |
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1 : 1 |
1 : 1 |
4 |
最小線寬線距 |
½oz / 18μm |
0.003" / 0.003" |
0.075 / 0.075mm |
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1oz / 35μm |
0.006" / 0.006" |
0.15 / 0.15mm |
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2oz / 70μm |
0.008" / 0.008" |
0.20 / 0.20mm |
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3oz / 105μm |
0.010" / 0.010" |
0.25 / 0.25mm |
5 |
其他 |
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防焊 |
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±0.003" |
±0.075mm |
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層間距 |
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±0.0024" |
±0.060mm |
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孔銅距(外層) |
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±0.003" |
±0.075mm |
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最小孔銅距 (內層) |
2L - 8L |
0.010" |
0.25mm |
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10L - 22L |
0.012" |
0.30mm |
6 |
外形 |
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板邊到板邊的距離 |
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±0.004" |
±0.100mm |
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孔到板邊的距離 |
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±0.004" |
±0.100mm |
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最小銅線至板邊距 |
外層 |
0.010" |
0.25mm |
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內層 |
0.016" |
0.40mm |
7 |
最大銅厚 |
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4oz |
140μm |
8 |
最大板厚 |
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0.189" |
4.80 mm |
9 |
最小板厚 |
雙麵 |
0.008" |
0.20mm |
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4層 |
0.016" |
0.40mm |
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6 -22層 |
0.020" |
0.60mm |
10 |
最小孔銅厚度 |
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0.004" |
0.10mm |
11 |
最小防焊厚度 |
0.004" |
0.10mm |
12 |
阻抗控製 (歐姆) |
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±10% |
±10% |
13 |
層數 |
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1~22層 |
14 |
板材 |
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FR-4，CEM-3，鋁基板材，Rogers板材，高TG基材 |
15 |
表麵處理 |
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噴錫、無鉛噴錫、沉金、沉銀、OSP、金手指、選擇性沉金，電鍍金 |
鋁基板製程能力
Layers:1-4 Layers
Max Dimension:1185mm*480mm
Min Dimension:5mm*5mm
Min Trace& line spacing:0.1mm
Warp & Twist:<0.5mm
Finished Product Thickness:0.2-4.5 mm
Copper Thickness:18-240 um
Hole Inner Copper Thickness:18-40 um
Hole Position Tolerance:+/-0.075 mm
Min Punching Hole Diameter:1.0mm
Min Punching Square Slot Specification::0.8mm*0.8mm
Silk Prints Circuit Tolerance:+/-0.075 mm
Outline Tolerance:CNC:+/-0.1mm; Mould:+/- 0.75mm
Min Hole Size:0.8 mm (No limitation in Max hole dimention)
V-CUT Angle Deviation:+/-0.5°
V-CUT Board Thickness Range:0.6mm-3.2mm
Min Component Mark Character Style:0.15 mm
Min Open Window for PADs:0.01mm
Solder Mask:Green, White, Blue, Matte black, Grey
Surface Finishing:HASL,Immersion Tin/Silver/Gold,gold plating,OSP
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